TSLR8266 Módulo Bluetooth RISC

The TLSR8266 is a Bluetooth Low Energy (BLE) SoC developed by Telink Semiconductor. It belongs to the TLSR826x series, designed for IoT applications with multi‑protocol support (BLE, Zigbee, 6LoWPAN, RF4CE, HomeKit, and proprietary 2.4 GHz protocols). It integrates a powerful MCU, RF transceiver, baseband, and analog peripherals, making it suitable for wireless communication modules and smart devices.

📝 Overview of TLSR8266

• Manufacturer: Telink Semiconductor (Shanghai, China).
• Series: TLSR826x (multi‑protocol IoT SoCs).
• Core: 32‑bit RISC MCU with integrated memory and peripherals.
• Flash memory: up to 1024 KB (depending on package).
• Connectivity:
  • Bluetooth Low Energy (BLE 4.0/4.2).
  • Bluetooth Mesh.
  • Zigbee.
  • 6LoWPAN.
  • RF4CE.
  • Proprietary 2.4 GHz protocols.
• Frequency band: ISM 2.4 GHz.
• Operating modes: multiple low‑power modes for energy efficiency.
• Applications: IoT nodes, smart home devices, wireless sensors, lighting control, and consumer electronics.

⚙️ Key Features

• MCU & Memory: Integrated RISC processor with embedded SRAM and Flash.
• RF Transceiver: Supports high‑performance wireless communication at 2.4 GHz.
• Peripherals:
  • ADC (Analog‑to‑Digital Converter).
  • PWM (Pulse Width Modulation).
  • Timers & interrupts.
  • KeyScan & QDEC (Quadrature Decoder).
• Clock system: Flexible clock sources for balancing performance and power.
• Efficiency: Designed for low‑power IoT devices, enabling long battery life.
• OTA support: Hardware Over‑The‑Air update capability.